Topological nanowires, topological materials confined in 1D, hold great promise for robust and scalable quantum computing and low-dissipation interconnect applications, for which the desirable properties of topologically protected electronic states must be controlled. In this talk, I will discuss my group’s efforts to develop a precision synthesis method to fabricate 1D topological systems at high throughput. We employ thermomechanical nanomolding to extrude single crystal nanowires of topological materials with controlled diameters. I will present transport properties of topological semimetal nanowires and explore their potential as extremely scaled, low-resistance interconnects. We demonstrate that the resistivity scaling of topological semimetal nanowires is fundamentally different from those of the state-of-the-art Cu interconnects and alternative metals, presenting them as viable candidates for advanced computing technologies.
Judy J. Cha is the Rick and Betty Tsai Ph.D. 1981 Professor in Materials Science and Engineering at Cornell University. She received her Ph.D. in Applied Physics from Cornell in 2009 and did her post-doc research at Stanford University in the Department of Materials Science and Engineering. Before joining Cornell in 2022, she was a faculty member in the Dept. of Mechanical Engineering and Materials Science at Yale University. She is a fellow of American Physical Society (APS) and a recipient of the SRC Young Faculty Award (2021), the Gordon & Betty Moore EPiQS Synthesis Investigator Award (2019), the NSF CAREER (2018), the Canadian Institute for Advanced Research (CIFAR) Azrieli Global Scholar for quantum materials (2017), the Yale Arthur Greer Memorial Prize (2016), and the IBM Faculty Award (2014).