Origins and Continued Innovations Supporting the Extreme Extendibility of Cu-Based ULSI Interconnect Technology
This year marks the 27th anniversary of IBM’s CMOS/Cu BEOL [Back End of the (manufacturing) Line] on-chip interconnect technology reaching production, with the first high-end Cu CPU chips passing manufacturing qualification and being sampled to customers. This announcement shocked the industry, who were unaware that Cu had been taken beyond the early research phase.
